The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Dec. 20, 2021
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Michael Nikkhoo, Saratoga, CA (US);

Brian Toleno, Cupertino, CA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01); F28F 21/02 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); G06F 1/163 (2013.01); G06F 1/206 (2013.01); F28F 21/02 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H05K 7/20445 (2013.01); H05K 7/20472 (2013.01);
Abstract

A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).


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