The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jan. 07, 2022
Applicant:
Motorola Solutions, Inc., Chicago, IL (US);
Inventors:
Edwin L Bradley, Chicago, IL (US);
Anthony J Suppelsa, Chicago, IL (US);
David J Meyer, Chicago, IL (US);
Assignee:
MOTOROLA SOLUTIONS, INC., Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H05K 1/111 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A device is provided that includes: a substrate including dielectric material and a conductive via extending into the substrate from a surface of the substrate. The device further includes a conductive pad positioned at the surface of the substrate and offset in a plane of the surface from the conductive via, the conductive pad to receive a solder joint connection to an electronic component. The conductive pad includes a concave edge that defines a gap with a convex edge of the conductive via.