The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

May. 18, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Guofeng Chen, Fremont, CA (US);

Michael Jon Wurtz, Lake Oswego, OR (US);

Rakesh Kumar, Singapore, SG;

You Qian, Singapore, SG;

Humberto Campanella-Pineda, Singapore, SG;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); B81B 3/00 (2006.01); H04R 3/00 (2006.01); H04R 17/02 (2006.01); H10N 30/05 (2023.01); H10N 30/30 (2023.01); H10N 30/50 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H04R 31/006 (2013.01); B81B 3/0021 (2013.01); H04R 3/00 (2013.01); H04R 17/02 (2013.01); H10N 30/05 (2023.02); H10N 30/302 (2023.02); H10N 30/306 (2023.02); H10N 30/50 (2023.02); H10N 30/872 (2023.02); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

An acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to a distal tip at a free end of the beam. The cantilevered beam has a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate. One or more electrodes are disposed on or in the proximal portion of the beam.


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