The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Aug. 30, 2021
Applicant:

Honor Device Co., Ltd., Shenzhen, CN;

Inventors:

Yang Liu, Shenzhen, CN;

Lei Feng, Shenzhen, CN;

Wei Zhang, Shenzhen, CN;

Wenxing Yao, Shenzhen, CN;

Assignee:

HONOR DEVICE CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); H04M 1/02 (2006.01); H05K 5/10 (2025.01);
U.S. Cl.
CPC ...
H04M 1/0283 (2013.01); H04M 1/0264 (2013.01); H05K 5/10 (2025.01);
Abstract

A cover body structure, a back cover, and an electronic device are provided, related to the field of electronic device technologies. The cover body structure includes a glass cover plate, a first ink layer, a first glue layer, and a plastic edge portion. The first ink layer is disposed at least on an edge of the glass cover plate. The first glue layer is disposed on the first ink layer on the edge of the glass cover plate. The plastic edge portion is disposed on the first glue layer on the edge of the glass cover plate. The first glue layer is a glue layer viscous at least at an injection molding temperature of the plastic edge portion, and the first ink layer is an ink layer that is able to withstand the injection molding temperature of the plastic edge portion.


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