The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Oct. 07, 2022
Applicant:

Navitas Semiconductor Limited, Dublin, IE;

Inventors:

Chung-Kuang Huang, Irvine, CA (US);

Tao Jin, Irvine, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/34 (2020.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H02H 7/08 (2006.01); H02H 7/09 (2006.01); H02K 11/33 (2016.01);
U.S. Cl.
CPC ...
H02H 7/0838 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H02H 7/09 (2013.01); H02K 11/33 (2016.01); H01L 2224/48137 (2013.01); H01L 2224/48175 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A semiconductor package for a multi-phase motor driving circuit comprises a driving unit, a switching unit, a first bonding wire, and a second bonding wire. The driving unit comprises a first driving IC, a second driving IC and a third driving IC, configured to couple with a controller. The switching unit comprises a first pair of power switches, a second pair of power switches and a third pair of power switches, configured to couple with the first driving IC, the second driving IC and the third driving IC, respectively. The first bonding wire is coupled between a sensing pin of the first driving circuit and a connection between the driving unit and a motor driven by the driving. The second bonding wire is coupled between a fault out pin of the first driving IC, the second driving IC and the third driving IC.


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