The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Nov. 29, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Ashim Dutta, Clifton Park, NY (US);
Ruturaj Nandkumar Pujari, Albany, NY (US);
Saumya Sharma, Easton, CT (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01B 11/27 (2006.01); G01R 1/073 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01B 11/272 (2013.01); G01R 1/073 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A system includes a wafer including at least an electronic component and a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component. The electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer. The probe pad is aligned with the wafer by using alignment marks. A prober alignment camera is employed to locate the alignment marks.