The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Oct. 02, 2019
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Takeshi Sakamoto, Hamamatsu, JP;

Yasutaka Suzuki, Hamamatsu, JP;

Iku Sano, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/53 (2014.01); H01L 21/66 (2006.01); B23K 103/00 (2006.01); B24B 7/22 (2006.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0006 (2013.01); B23K 26/0093 (2013.01); B23K 26/032 (2013.01); B23K 26/53 (2015.10); H01L 22/12 (2013.01); B23K 2103/56 (2018.08); B24B 7/228 (2013.01); B24B 49/12 (2013.01);
Abstract

An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect a tip position of a fracture in an inspection region between a back surface and the modified region closest to the back surface of the semiconductor substrate. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating from the front surface side of the semiconductor substrate to the back surface side.


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