The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jun. 16, 2022
Huawei Technologies Duesseldorf Gmbh, Duesseldorf, DE;
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;
Fraunhofer-Gesellschaft zur FÖrderung der angewandten Forschung e.V., Munich, DE;
Huawei Technologies Duesseldorf GmbH, Duesseldorf, DE;
Abstract
A method for manufacturing a device is provided. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method comprises selectively attaching a second surface of a subset of the plurality of chips to a conveyor carrier by means of a structured adhesive layer of the conveyor layer. Further, the method comprises selectively releasing the subset of the plurality of chips from the first carrier by means of debonding corresponding sections of the adhesive layer of the first carrier. Further, the method comprises attaching the first surface of the subset of the plurality of chips to a substrate of the device.