The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Mar. 03, 2023
Applicant:

Mainstream Engineering Corporation, Rockledge, FL (US);

Inventor:

Benjamin S. Woods, Melbourne, FL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/004 (2006.01); B05D 1/26 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); H01B 13/14 (2006.01);
U.S. Cl.
CPC ...
H01B 13/004 (2013.01); B05D 1/265 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); H01B 13/14 (2013.01);
Abstract

An apparatus for the extrusion of a solid wire into a resin or paste is disclosed. The apparatus consists of two main parts including an adapter for constraining the wire until mixing with the resin or paste ('wire injector'), and a motor-driven gear system that feeds the wire into the injector (‘wire extruder’). With this system, a bare wire can be extruded allowing for the creation of lead-in/lead-out sections, or for use with a resin or paste without an inherent curing, drying, or solidifying mechanism. Additionally, this apparatus allows for the extrusion of small (30-40 AWG) wires, enabling unique applications such as the injection of a resistive wire where smaller diameter wires are advantageous for minimized electrical or thermal overhead.


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