The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
May. 09, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Timothy Phung, Milpitas, CA (US);
Muir Kumph, Croton on Hudson, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
G06N 10/40 (2022.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
G06N 10/40 (2022.01); H01L 23/5227 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 25/0655 (2013.01);
Abstract
A modular electronic structure includes a first chip having a first interleaved portion and a first electromagnetic coupler on the first interleaved portion. There is a second chip having a second interleaved portion and a second electromagnetic coupler on the second interleaved portion and configured to electromagnetically couple with the first electromagnetic coupler. The first interleaved portion fits between two surfaces of the second chip. The second interleaved portion fits between two surfaces of the first chip.