The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Mar. 10, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Toshihiro Tsujimura, Ota Tokyo, JP;

Daisuke Ando, Yokohama Kanagawa, JP;

Hitoshi Imi, Yokohama Kanagawa, JP;

Takahiro Aoki, Gyoda Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/3308 (2020.01); G01N 25/18 (2006.01); G06F 30/337 (2020.01); G06F 30/367 (2020.01); G06F 30/373 (2020.01); G06F 30/398 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G06F 30/3308 (2020.01); G01N 25/18 (2013.01); G06F 30/337 (2020.01); G06F 30/367 (2020.01); G06F 30/373 (2020.01); G06F 30/398 (2020.01); G06F 2119/08 (2020.01);
Abstract

According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.


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