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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12325770 B1

PDFFull Text
Date of Patent:
Jun. 10, 2025

Filed:

Aug. 05, 2022

Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Applicant:

Mitsubishi Gas Chemical Company, Inc, Tokyo, JP;

Inventors:

Yuji Nakashima, Tokyo, JP;

Takashi Kobayashi, Tokyo, JP;

Shunsuke Hirano, Tokyo, JP;

Keiichi Hasebe, Tokyo, JP;

Assignee:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Attorneys:

Renner, Kenner

Arthur M. Reginelli

Primary Examiner:

Ian A Rummel

Int. Cl.
CPC ...
C08F 257/02 (2006.01); C08J 5/24 (2006.01); C08K 5/315 (2006.01); C08L 51/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08F 257/02 (2013.01); C08J 5/249 (2021.05); C08K 5/315 (2013.01); C08L 51/003 (2013.01); H05K 1/0366 (2013.01); C08J 2351/06 (2013.01); C08J 2451/08 (2013.01); C08J 2453/02 (2013.01);
Abstract

Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).

Find Patent Forward Citations

Nakashima, Yuji. (2025). Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board (U.S. Patent No. 12325770). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12325770

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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