The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Jan. 12, 2024
Applicant:

Sekisui Specialty Chemicals America, Llc, Dallas, TX (US);

Inventors:

David B. Wurm, Pasadena, TX (US);

George Shitera, Pasadena, TX (US);

Vinh Nguyen, Pasadena, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/60 (2006.01); C10M 173/02 (2006.01); C10N 30/16 (2006.01); C10N 30/18 (2006.01); C10N 40/36 (2006.01);
U.S. Cl.
CPC ...
B29C 33/60 (2013.01); C10M 173/02 (2013.01); C10M 2209/04 (2013.01); C10N 2030/16 (2013.01); C10N 2030/18 (2013.01); C10N 2040/36 (2013.01);
Abstract

A homogeneous, aqueous mold release solution including: 5 to 90 wt % water; 3 to 40 wt % polyvinyl alcohol; 0.01 to 3.2 wt % surfactant; 1 to 20 wt % sugar alcohol; 0.005 to 1.05 wt % defoamer; and up to 50 ppm biocide, where a total of all components adds to 100 wt %. The mold release solutions have a viscosity in a range from 20 to 600 cps when measured at 23° C. In another aspect, embodiments disclosed herein relate to a homogeneous, aqueous mold release solution including: 5 to 85 wt % water; 10.5 to 15 wt % polyvinyl alcohol; 0.56 to 0.8 wt % surfactant; 1 to 8 wt % sugar alcohol; 0.01 to 0.3 wt % defoamer; and up to 50 ppm biocide, wherein a total of all components adds to 100 wt %. Also disclosed are films prepared from the mold release solutions, as well as methods of coating a substrate using such mold release solutions.


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