The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Jan. 25, 2021
Applicant:

Nhk Spring Co., Ltd., Yokohama, JP;

Inventors:

Sosuke Kurebayashi, Yokohama, JP;

Naoki Iwamoto, Yokohama, JP;

Assignee:

NHK SPRING CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26D 7/00 (2006.01); B21D 37/10 (2006.01); B26F 1/40 (2006.01);
U.S. Cl.
CPC ...
B26D 7/0006 (2013.01); B21D 37/10 (2013.01); B26F 1/40 (2013.01);
Abstract

A lift mechanism of a die set apparatus includes a guide pin, a linear motion guide member, a first washer, a second washer, a first coil spring, and a second coil spring. A first positioning portion and a second positioning portion control a first end turn portion and a second end turn portion from moving in a radial direction of the guide pin in a state where a first gap is formed between the first coil spring and the guide pin. A third positioning portion and a fourth positioning portion control a third end turn portion and a fourth end turn portion from moving in the radial direction of the guide pin in a state where a second gap is formed between the second coil spring and the guide pin.


Find Patent Forward Citations

Kurebayashi, Sosuke. (2025). Die set apparatus (U.S. Patent No. 12325147). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12325147

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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