The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Apr. 24, 2020
Applicant:

Musashi Engineering, Inc., Mitaka, JP;

Inventor:

Kazumasa Ikushima, Mitaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/36 (2006.01); B05D 3/06 (2006.01); B29C 65/00 (2006.01); G02F 1/13 (2006.01); G02F 1/1341 (2006.01);
U.S. Cl.
CPC ...
B05D 1/36 (2013.01); B05D 3/067 (2013.01); B29C 66/95 (2013.01); G02F 1/1303 (2013.01); G02F 1/1341 (2013.01);
Abstract

Continuously manufacturing a planar layered material by repeatedly performing a bank portion forming step of supplying a first liquid material to a first workpiece and forming a bank portion in a frame shape, filled portion forming step of supplying a second liquid material to an inner side of the formed bank portion and forming a filled portion, and a bonding step of bonding the first workpiece with the filled portion formed thereon and a second workpiece to each other, the planar layered material manufacturing method comprises a height measurement step of measuring, by a height measurement device, a height of the filled portion or the bank portion formed on the first workpiece, and a height adjustment step of adjusting a relative height between the filled portion and the bank portion on the basis of the height of the filled portion or the bank portion measured in the height measurement step.


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