The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Apr. 10, 2023
Applicant:

Professional Plating Inc., Anoka, MN (US);

Inventors:

Craig A. Ingalls, Burnsville, MN (US);

David R. Kaar, Minneapolis, MN (US);

Ross William Peterson, Ramsey, MN (US);

Assignee:

Professional Plating Inc., Anoka, MN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/14 (2006.01); A61B 5/00 (2006.01); A61B 5/25 (2021.01); A61B 18/18 (2006.01); A61M 25/10 (2013.01); C23C 14/04 (2006.01); C23C 14/20 (2006.01); C23C 14/34 (2006.01); C23C 14/54 (2006.01); C23C 14/56 (2006.01);
U.S. Cl.
CPC ...
A61M 25/1029 (2013.01); A61B 5/25 (2021.01); A61B 5/6853 (2013.01); C23C 14/042 (2013.01); C23C 14/20 (2013.01); C23C 14/34 (2013.01); C23C 14/54 (2013.01); C23C 14/56 (2013.01); A61M 2025/1031 (2013.01); A61M 2025/1075 (2013.01);
Abstract

A thin walled balloon formed in polymer tubing has a patterned metal layer on its outer surface, created by physical vapor deposition (PVD). The pattern is defined by a stencil mask assembled around the balloon, with the balloon inflated therein. The PVD occurs without deforming or degrading the polymer material of the balloon, by actively pulling heat away from the balloon a) by forming the stencil mask out of metal; b) by providing a metal heat conduction path away from the balloon to a heat sink, such as outside the vacuum chamber, and/or c) by flow of a cooling fluid within the balloon during the PVD process. Proper PVD process parameters are selected to minimize heat generation, such as having argon pressure in the range of 0.8 to 1.2 milli-torr and generating the plasma at a power of less than about 200 watts/square inch of effective target surface area.


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