The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Sep. 07, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Myoung Lae Roh, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 10/817 (2023.01); H10N 10/17 (2023.01);
U.S. Cl.
CPC ...
H10N 10/817 (2023.02); H10N 10/17 (2023.02);
Abstract

According to an embodiment, a thermoelectric module is disclosed, the thermoelectric module comprising: a first heat-conducting member; a second heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; a first sealing member disposed outside the thermoelectric element; and a second sealing member disposed outside the first sealing member, wherein the thermoelectric element includes a first substrate, a second substrate facing the first substrate, and a semiconductor structure disposed between the first substrate and the second substrate, and the first sealing member is disposed between the upper surface of the first substrate and the lower surface of the second substrate, and includes a convex side surface toward the semiconductor structure, and the second sealing member is in contact with the side surface of the first substrate and the side surface of the second substrate, and includes a gap between the second sealing member and the convex side surface of the first sealing member.


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