The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
May. 10, 2022
Applicant:
Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;
Inventors:
François Templier, Grenoble, FR;
Sébastien Becker, Grenoble, FR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 25/075 (2006.01); H10F 55/15 (2025.01); H10H 20/01 (2025.01); H10H 20/824 (2025.01); H10H 20/833 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/0756 (2013.01); H10H 20/013 (2025.01); H10H 20/824 (2025.01); H10H 20/8512 (2025.01); H10H 20/857 (2025.01); H10H 20/0361 (2025.01); H10H 20/0364 (2025.01);
Abstract
A method of manufacturing an optoelectronic device, including the steps of: a) arranging an active photosensitive diode stack on a first substrate; b) transferring the active photosensitive diode stack onto an integrated control circuit previously formed inside and on top of a second semiconductor substrate, and then removing the first substrate; c) arranging an active light-emitting diode stack on a third substrate; and d) after steps b) and c), transferring the active light-emitting diode stack onto the active photosensitive diode stack, and then removing the third substrate.