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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12322709 B1

PDFFull Text
Date of Patent:
Jun. 03, 2025

Filed:

Jul. 06, 2022

Semiconductor device and laser marking method

Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventors:

Kosuke Masuzawa, Kyoto, JP;

Hiroshi Yoshida, Toyama, JP;

Assignee:

NUVOTON TECHNOLOGY CORPORATION JAPAN, Kyoto, JP;

Attorney:

Rimon P.C.

Primary Examiner:

Brian W Jennison

Assistant Examiner:

Kristina J Babinski

Int. Cl.
CPC ...
H01L 23/544 (2006.01); B23K 26/073 (2006.01); B23K 26/18 (2006.01); B23K 26/40 (2014.01); B23K 101/00 (2006.01); B23K 101/40 (2006.01); G09F 7/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B23K 26/073 (2013.01); B23K 26/18 (2013.01); B23K 26/40 (2013.01); G09F 7/165 (2013.01); B23K 2101/007 (2018.08); B23K 2101/40 (2018.08); H01L 2223/54406 (2013.01);
Abstract

A semiconductor device that is a facedown mountable, chip-size-package type semiconductor device, the semiconductor device including: a semiconductor substrate; and a metal layer that is disposed on the semiconductor substrate and is exposed to outside. One or more marks are provided on an exposed surface of the metal layer. The one or more marks each include an outline portion defining an outline of the mark, and a central portion located inward of the outline portion. In a plan view of the exposed surface of the metal layer, the outline portion has a color different from at least one of a color of the central portion or a color of a base portion that is a portion of the exposed surface of the metal layer on which the one or more marks are not provided.

Find Patent Forward Citations

Masuzawa, Kosuke. (2025). Semiconductor device and laser marking method (U.S. Patent No. 12322709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12322709

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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