The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Aug. 09, 2022
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Huibin Chen, Shanghai, CN;

Haiyan Liu, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); B23K 26/24 (2014.01); H01L 21/48 (2006.01); H01L 25/11 (2006.01); H02M 7/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); B23K 26/24 (2013.01); H01L 21/4882 (2013.01); H01L 25/115 (2013.01); H02M 7/003 (2013.01); B23K 2101/36 (2018.08);
Abstract

An encapsulation structure of a power module is disclosed in this application, which includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tubes. The metal baseplate has a protrusion part protruding. There are a plurality of grooves on a fluid pipe of the liquid cooler, a cavity exists between two adjacent grooves of the plurality of grooves, and the cavity is configured to communicate the two adjacent grooves. The power module body is lapped on the groove, a back side of the protrusion part is in contact with an edge surface of the groove, and the heat dissipation finned tubes are placed in the groove.


Find Patent Forward Citations

Chen, Huibin. (2025). Encapsulation structure and encapsulation method of power module (U.S. Patent No. 12322678). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12322678

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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