The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Sep. 06, 2022
Applicant:

Metaland Llc, Doral, FL (US);

Inventors:

David Finn, Fussen Weissensee, DE;

Darren Molloy, Killour, IE;

Daniel Pierrard, Killour, IE;

Assignee:

Metaland LLC, Doral, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/02 (2006.01); B29C 45/14 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07724 (2013.01); B29C 45/14647 (2013.01);
Abstract

Metal layers () of a smartcard (SC,) have module openings () for receiving a transponder chip module (TCM). Thermosetting resin (TR,B,A,B,A,B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer () may have a slit (S;B,) which may also be filled by the thermosetting resin. A second metal layer (ML,) disposed above the first metal layer () may have a slit (S,A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC,) may be disposed between the first and second metal layers, with magnetic shielding material () disposed between the booster antenna circuit and the second metal layer ().


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