The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Jun. 10, 2022
Applicant:

Schlumberger Technology Corporation, Sugar Land, TX (US);

Inventors:

Joseph Varkey, Richmond, TX (US);

Maria Grisanti, Missouri City, TX (US);

David Kim, Katy, TX (US);

Ian Mace, Sugar Land, TX (US);

Tam Tran, Sugar Land, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/44 (2006.01); H01B 7/02 (2006.01); H01B 7/04 (2006.01); H01B 7/18 (2006.01);
U.S. Cl.
CPC ...
G02B 6/443 (2013.01); G02B 6/4416 (2013.01); G02B 6/4432 (2013.01); H01B 7/0241 (2013.01); H01B 7/1895 (2013.01); H01B 7/046 (2013.01);
Abstract

Cables that include a conductor and an optical fiber. In some embodiments, the cable can include an optical fiber loosely disposed within an enclosure. A conductor layer can be disposed about the enclosure. An insulation layer can be disposed about the at least one conductor layer. An inner layer of armor strength members can be helically disposed about the insulation layer. An outer layer of armor strength members can be helically disposed about the inner layer of armor strength members. The armor strength members in the outer layer of armor strength members can be at an opposite helix compared to the armor strength members in the inner layer of armor strength members. An outer jacket can be disposed about the outer layer. In other embodiments, the cable can include an optical fiber in a coupled electro-optical package, where the conductor layer can be disposed about the electro-optical package.


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