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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12320028 B1

PDFFull Text
Date of Patent:
Jun. 03, 2025

Filed:

Dec. 22, 2022

Electrochemical three-dimensional printing and soldering

Applicant:

University of South Florida, Tampa, FL (US);

Inventors:

Arash Takshi, Tampa, FL (US);

Sabrina Marie Rosa-Ortiz, Tampa, FL (US);

Assignee:

UNIVERSITY OF SOUTH FLORIDA, Tampa, FL (US);

Attorney:

Quarles & Brady LLP

Primary Examiner:

Louis J Rufo

Int. Cl.
CPC ...
C25D 5/08 (2006.01); B29C 64/20 (2017.01); B29C 64/30 (2017.01); B33Y 10/00 (2015.01); C25D 1/00 (2006.01); C25D 3/38 (2006.01); C25D 5/00 (2006.01); C25D 5/02 (2006.01); C25D 5/04 (2006.01); C25D 5/54 (2006.01); C25D 7/00 (2006.01); C25D 7/04 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 17/10 (2006.01); C25D 17/12 (2006.01); C25D 21/12 (2006.01); H05K 1/18 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C25D 5/08 (2013.01); B29C 64/20 (2017.08); C25D 1/003 (2013.01); C25D 3/38 (2013.01); C25D 5/003 (2013.01); C25D 5/02 (2013.01); C25D 5/026 (2013.01); C25D 5/04 (2013.01); C25D 5/54 (2013.01); C25D 7/00 (2013.01); C25D 7/04 (2013.01); C25D 17/005 (2013.01); C25D 17/06 (2013.01); C25D 17/10 (2013.01); C25D 17/12 (2013.01); C25D 21/12 (2013.01); H05K 3/241 (2013.01); H05K 3/246 (2013.01); H05K 3/328 (2013.01); B29C 64/30 (2017.08); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); H05K 1/097 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/013 (2013.01);
Abstract

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

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