The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Feb. 26, 2024
Applicant:
Taiyo Holdings Co., Ltd., Hiki-gun, JP;
Inventor:
Yoshikazu Daigo, Hiki-gun, JP;
Assignee:
TAIYO HOLDINGS CO., LTD., Hiki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); C08K 2201/001 (2013.01); H05K 2201/0209 (2013.01);
Abstract
Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thermal conductivity of a cured product of the thermosetting resin composition is adjusted to 2.5 W/m·K or more.