The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Jul. 08, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Inkwon Kim, Hwaseong-si, KR;
Yearin Byun, Hwaseong-si, KR;
Sangkyun Kim, Hwaseong-si, KR;
Sanghyun Park, Hwaseong-si, KR;
Hyosan Lee, Hwaseong-si, KR;
Wonki Hur, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/00 (2006.01); B24B 1/00 (2006.01); B24B 37/04 (2012.01); C09G 1/04 (2006.01); C09G 1/06 (2006.01); C09G 1/18 (2006.01); C09K 3/14 (2006.01); C09K 13/06 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/00 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09G 1/18 (2013.01); C09K 3/1454 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract
A slurry composition for a chemical mechanical polishing (CMP) process, the slurry composition including a first organic polishing booster including a quaternary amine group; a second organic polishing booster including an amino acid; and a carrier; wherein inorganic polishing particles are not included in the slurry composition or included in an amount of less than 0.01% by weight.