The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Mar. 25, 2021
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kodai Shimono, Tokyo, JP;
Hiroshi Tokutomi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A fiber-reinforced composite material molding apparatus includes a molding die, a bagging film that seals a fiber base material in the molding die to form a hermetically sealed space, an intake line that depressurizes the hermetically sealed space, and a resin injection line that injects a resin material into the fiber base material. The molding die includes a main body portion including a main groove that extends along a longitudinal direction and is connected to the resin injection line, lateral grooves that are formed at a plurality of positions in the longitudinal direction and extend along a width direction, and a step portion that extends along the longitudinal direction and is disposed between the main groove and the lateral grooves, and a lid portion that extends along the longitudinal direction, is disposed being in contact with the step portion to cover the main groove, and forms a part of a molding surface. The main body portion includes a communication groove through which the main groove is communicated with the lateral grooves.