The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Nov. 08, 2023
Applicant:

Precision Machinery Research & Development Center, Taichung, TW;

Inventors:

Sung-Yuan Huang, Taichung, TW;

Yi-Kai Huang, Taichung, TW;

Ying-Bin Wang, Taichung, TW;

Ming-Ching Chou, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/12 (2006.01); B29C 33/04 (2006.01); B29C 33/08 (2006.01); F24H 1/20 (2022.01);
U.S. Cl.
CPC ...
B29C 35/12 (2013.01); B29C 33/04 (2013.01); B29C 33/08 (2013.01); F24H 1/203 (2013.01);
Abstract

A high-efficiency mold temperature control system includes a dielectric heating module, a cooling module, and a flow control module. The dielectric heating module includes a heating circuit, a dielectric heater, a high-frequency power supply, a high-temperature heat medium storage tank, and a heat circulation pump. The cooling module includes a cooling circuit, a heat exchanger, a low-temperature heat medium storage tank, and a cold circulation pump. The flow control module includes multiple thermal switch valves and multiple cooling switch valves to control a high-temperature heat medium to the heating circuit or control a low-temperature heat medium to the cooling circuit. Through the design of the dielectric heating module, the high-temperature heat medium can be rapidly heated and the overall heating efficiency can be enhanced, thereby rapidly heating or cooling a mold and controlling the rapid heating and cooling of the mold.


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