The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Oct. 13, 2022
Applicant:

Pink Gmbh Thermosysteme, Wertheim, DE;

Inventor:

Christoph Oetzel, Freudenberg Boxtal, DE;

Assignee:

PINK GMBH THERMOSYSTEME, Wertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 20/026 (2013.01); B23K 2101/40 (2018.08);
Abstract

The invention relates to a diffusion soldering device and/or sintering device, to a press tool and to a system comprising these for connecting components of at least one electronic assembly, in particular of a plurality of electronic assemblies, by means of diffusion soldering or pressure sintering. The device comprises an upper tool and a lower tool between which the assemblies are held, wherein the upper tool has at least one pressure pad filled or fillable with a fluid or displaceable medium whose internal pressure is variable and at least one, in particular several, plungers in operative connection to the pressure pad and configured for transmission of a press force, generated by a pressure increase in the pressure pad, to the assemblies. The present invention provides that the upper tool has a guide frame in which the plunger(s) is/are guided axially movable along the effective direction of the press force, and the plunger(s) is/are movably guided inside the guide frame while sealed against the pressure pad. In a subordinate aspect, a press tool is proposed that is usable in an aforementioned diffusion soldering or sintering device, and a multi-module system comprising a press tool and/or an aforementioned device.


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