The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Apr. 19, 2021
Applicant:
Board of Regents, the University of Texas System, Austin, TX (US);
Inventors:
Taylor Ware, Austin, TX (US);
Walter Voit, Austin, TX (US);
Assignee:
Board of Regents, The University of Texas System, Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 5/24 (2021.01); A61B 5/00 (2006.01); A61L 31/04 (2006.01); A61L 31/06 (2006.01); A61L 31/08 (2006.01); A61L 31/14 (2006.01); B05D 3/00 (2006.01); C08J 7/04 (2020.01);
U.S. Cl.
CPC ...
A61L 31/14 (2013.01); A61B 5/24 (2021.01); A61B 5/6847 (2013.01); A61B 5/686 (2013.01); A61L 31/048 (2013.01); A61L 31/06 (2013.01); A61L 31/088 (2013.01); B05D 3/002 (2013.01); C08J 7/0423 (2020.01); A61L 2400/16 (2013.01); A61L 2420/02 (2013.01);
Abstract
The invention discloses a method for adhering a metal layer to a polymer substrate and device manufacture therefrom. The metal layer is deposited on a sacrificial substrate of a mold to form part of an interior surface of the mold, and a solution of monomers is deposited on the metal layer. The monomers are then polymerized together to form the polymer substrate on the metal layer. Then the polymer substrate is removed from the mold such that the metal layer is removed from the mold and adhered to the polymer substrate.