The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Mar. 23, 2022
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Koji Abe, Tokushima, JP;
Kazusa Nishiuchi, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/854 (2025.01); H10H 20/856 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/854 (2025.01); H10H 20/856 (2025.01); H10H 20/0362 (2025.01); H10H 20/0364 (2025.01);
Abstract
A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance; and covering lateral faces of the light emitting elements with the first resin by spreading the first resin over the region in which the light emitting elements are mounted.