The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Jun. 09, 2021
Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen, CN;
Naoyuki Urasaki, Chikusei, JP;
Kanako Yuasa, Saitama, JP;
SHENZHEN JUFEI OPTOELECTRONICS CO., LTD., Shenzhen, CN;
Abstract
An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The package has a recessed part served as an optical semiconductor element mounting region. The package includes a resin molding and at least two lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to and spaced apart from each other, and at least a portion of main faces of the lead electrodes forms a part of the bottom face of the recessed part. The main face of the lead electrode and a side face of the lead electrode are built up to an angle, the side face of the lead electrode is non-linear, and there is no gap at a joint face between the resin molding and the lead electrodes.