The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Nov. 20, 2023
Applicant:
Seoul Viosys Co., Ltd., Ansan-si, KR;
Inventor:
Ik Kyu You, Ansan-si, KR;
Assignee:
SEOUL VIOSYS CO., LTD., Ansan-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 21/66 (2006.01); H01L 25/075 (2006.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 22/12 (2013.01); H01L 25/0753 (2013.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01);
Abstract
A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.