The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jun. 26, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Tadashi Iijima, Kanagawa, JP;

Yuki Miyanami, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10F 39/809 (2025.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H10F 39/018 (2025.01); H10F 39/811 (2025.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

Provided is a semiconductor apparatus that can realize further enhancement of capabilities regarding a stacked structure of plural substrates. The semiconductor apparatus includes a first substrate that includes a first element layer including a first active element, and a first wiring layer arranged on the first element layer; and a second substrate that includes a second element layer including a second active element arranged on the first wiring layer, and a second wiring layer arranged on the second element layer, in which the first substrate and the second substrate are stacked one on another, and the second active element is provided in a compound semiconductor substrate.


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