The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jan. 31, 2023
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Tianzhu Fan, Houston, TX (US);

Feng Zhou, Ann Arbor, MI (US);

Ercan Mehmet Dede, Ann Arbor, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); B29C 64/209 (2017.01); B29C 64/314 (2017.01); B29C 71/02 (2006.01); B29C 71/04 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01); B29K 33/04 (2006.01); B29K 105/00 (2006.01); B29K 105/16 (2006.01); B29K 505/14 (2006.01); B29K 507/04 (2006.01); B29K 509/02 (2006.01); B29L 31/34 (2006.01); B41J 2/175 (2006.01); B41J 3/407 (2006.01); B41M 1/26 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4664 (2013.01); B29C 64/209 (2017.08); B29C 64/314 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); H05K 3/1241 (2013.01); H05K 3/125 (2013.01); H05K 3/4673 (2013.01); B29K 2033/04 (2013.01); B29K 2105/0002 (2013.01); B29K 2105/162 (2013.01); B29K 2505/14 (2013.01); B29K 2507/04 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0012 (2013.01); B29L 2031/3425 (2013.01); B41J 2/17596 (2013.01);
Abstract

A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.


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