The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

May. 25, 2023
Applicant:

Aac Microtech (Changzhou) Co., Ltd., Jiangsu, CN;

Inventors:

Jingwei Yu, Changzhou, CN;

Qibo Li, Changzhou, CN;

Zhongfeng Gao, Changzhou, CN;

Siyuan Ni, Changzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/025 (2013.01);
Abstract

A cover plate includes a substrate provided and a bridge structure. The bridge structure includes first and second ribs, and a bridge body. The first rib has first forming fillet formed at junction between the first rib and the substrate, and second forming fillet formed at junction between the first rib and the bridge body. The first and second forming fillets each have a radius greater than 0.6 mm. An included angle formed between a length extending direction of first rib and a plane of bridge body is greater than 120°. The first rib has a width smaller than a width of the second rib. With comprehensive consideration of a bridge angle, a bridge forming angle and a bridge width in design of the bridge structure, the first rib and the second rib are force-balanced, reduces a fracture risk of the rib, and improves a yield of the cover plate.


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Yu, Jingwei. (2025). Cover plate and speaker module (U.S. Patent No. 12317018). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12317018

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