The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jul. 21, 2022
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventor:

Samuel Tam, Daly City, CA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 23/51 (2023.01); G02B 27/01 (2006.01); H04N 23/53 (2023.01); H04N 23/54 (2023.01);
U.S. Cl.
CPC ...
H04N 23/51 (2023.01); G02B 27/0172 (2013.01); H04N 23/53 (2023.01); H04N 23/54 (2023.01); G02B 2027/0138 (2013.01); G02B 2027/0178 (2013.01);
Abstract

A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side includes a number of bonding pads. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape includes a number of traces positioned between a first side and a second side. The first side of the HDI tape is coupled to the second side of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.


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