The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Aug. 30, 2023
Applicant:

L3harris Technologies, Inc., Melbourne, FL (US);

Inventors:

Pedro Rodriguez-Garcia, Heath, TX (US);

Joshua Martin, Rockwall, TX (US);

Robert George, Caddo Mills, TX (US);

Assignee:

L3Harris Technologies, Inc., Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/045 (2013.01); H01Q 1/22 (2013.01); H01Q 21/065 (2013.01);
Abstract

An antenna module comprises: stacked printed circuit boards (PCBs) (stacked PCBs) centered on an axis and including: a first PCB having a ground plane; a second PCB, spaced above the first PCB, having a first radiator pair and a second radiator pair that face the ground plane and orthogonally crisscross each other at the axis, each radiator pair having respective signal and ground connection pads adjacent to the axis to form a coincident phase center at the axis for each radiator pair; a third PCB, spaced above the second PCB, for impedance matching; and signal connectors extending through the first PCB; and support PCBs extending from the ground plane to the second PCB, the support PCBs having microstrip feeds to connect the respective signal and ground connection pads of the first radiator pair and the second radiator pair to the signal connectors and to the ground plane.


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