The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
May. 19, 2022
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Mustafa Acar, Eindhoven, NL;
Philipp Franz Freidl, Weurt, NL;
Antonius Hendrikus Jozef Kamphuis, Nijmegen, NL;
Jan Willem Bergman, Veghel, NL;
Rajesh Mandamparambil, Eindhoven, NL;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/48 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/48 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/0087 (2013.01); H01Q 23/00 (2013.01);
Abstract
A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.