The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Feb. 26, 2021
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Tadahiko Sato, Kawasaki, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/053 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/04 (2013.01); H01L 23/053 (2013.01); H01L 23/49811 (2013.01); H01L 24/37 (2013.01); H01L 23/142 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/40091 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73221 (2013.01);
Abstract

A lead frame structure for connecting a semiconductor chip to a connection target includes a conductive member electrically connecting the semiconductor chip and the connection target. The conductive member includes a first bonding part having a main surface, disposed on one side of the conductive member and being bonded to the semiconductor chip, a second bonding part having a main surface, being disposed on another side of the conductive member that is spaced from the one side in one direction and being bonded to the connection target, and a joining part having a wall section intersecting the main surface of the first bonding part and the main surface of the second bonding part, the wall section joining a portion of the first bonding part to a portion of the second bonding part.


Find Patent Forward Citations

Loading…