The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Feb. 24, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Kijong Park, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H01L 25/16 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A semiconductor package includes a substrate including an upper pad at a top surface of the substrate, a semiconductor chip on the substrate and including a chip pad at a top surface of the semiconductor chip, a connecting structure on the semiconductor chip and including a connecting pad at a top surface of the connecting structure and electrically connected to the upper pad, an encapsulant covering the substrate, the semiconductor chip, and the connecting structure, and a test terminal on the connecting structure and extending through the encapsulant. The connecting structure electrically interconnects the semiconductor chip and the test terminal.


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