The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Mar. 05, 2024
Applicant:

Cypress Semiconductor Corporation, San Jose, CA (US);

Inventors:

Chenxi Huang, San Jose, CA (US);

Yung Chen, San Jose, CA (US);

Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 24/14 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14515 (2013.01);
Abstract

Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Systems include a printed circuit board, a microprocessor, a ball grid array, and a substrate. The ball grid array includes a first solder ball and a second solder ball. The substrate includes a non-linear conductive routing electrically coupling the first solder ball and the second solder ball. The non-linear conductive routing includes a first routing section connected to the first solder ball, and a second routing section connected to the second solder ball. The non-linear conductive routing further includes a third routing section connected to the first routing section, and a fourth routing section connected to the third routing section, wherein each of the third routing section and the fourth routing section are rotational routing sections configured to flow current in a first rotational direction.


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