The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Nov. 20, 2020
Korea Institute of Machinery & Materials, Daejeon, KR;
Center for Advanced Meta-materials, Daejeon, KR;
Jae-Hyun Kim, Daejeon, KR;
Sejeong Won, Daejeon, KR;
Hak Joo Lee, Daejeon, KR;
Bongkyun Jang, Daejeon, KR;
Hyeon-Don Kim, Daejeon, KR;
Kwangseop Kim, Daejeon, KR;
Sang Min Kim, Daejeon, KR;
KOREA INSTITUTE OF MACHINERY & MATERIALS, Daejeon, KR;
CENTER FOR ADVANCED META-MATERIALS, Daejeon, KR;
Abstract
An embodiment of the present invention provides an element transferring method that may increase a yield of transferring an element, and an electronic panel manufacturing method using the same. The element transferring method includes: preparing a carrier film in which a first surface of an element on which a terminal is formed is adhered to an adhesive surface; providing a cover adhesive layer on the adhesive surface so that the second surface of the element that is opposite to the first surface and where the terminal is not formed is covered; transferring the element to the target substrate by adhering the cover adhesive layer to the target substrate while the second surface is facing the target substrate; and separating the carrier film from the element, wherein in transferring the element, the carrier film is pressed so that the surface of the cover adhesive layer is flat at the same height as the terminal.