The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Feb. 25, 2021
Applicant:

Qromis, Inc., Santa Clara, CA (US);

Inventors:

Vladimir Odnoblyudov, Danville, CA (US);

Cem Basceri, Los Gatos, CA (US);

Shari Farrens, Boise, ID (US);

Assignee:

QROMIS, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C30B 29/06 (2006.01); C30B 29/40 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01); H10D 86/00 (2025.01); H10D 86/01 (2025.01); H10H 20/01 (2025.01); H10H 20/81 (2025.01);
U.S. Cl.
CPC ...
H01L 21/0242 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 29/406 (2013.01); H01L 21/0243 (2013.01); H01L 21/0245 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/0254 (2013.01); H10D 86/00 (2025.01); H10D 86/01 (2025.01); H10H 20/0137 (2025.01); H10H 20/81 (2025.01); C30B 29/403 (2013.01);
Abstract

An engineered substrate structure includes a ceramic substrate having a front surface characterized by a plurality of voids, and a barrier layer encapsulating the ceramic substrate. The barrier layer defining a plurality of valleys corresponding to the plurality of voids. The engineered substrate structure further includes a first bonding layer comprising a bonding layer material and coupled to the barrier layer on the front surface of the ceramic substrate. The first bonding layer defines a plurality of fill regions filled with the bonding layer material in the plurality of valleys corresponding to the plurality of voids. The engineered substrate structure further includes a second bonding layer coupled to the first bonding layer, and a substantially single crystalline layer joined to the second bonding layer.


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