The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Oct. 04, 2024
Pacific Light & Hologram, Inc., San Gabriel, CA (US);
Jonathan Seamus Blackley, South Pasadena, CA (US);
Richard Bahr, Atherton, CA (US);
Watson Brent Boyett, Los Angeles, CA (US);
Sylvain Marcel Colin, Ventura, CA (US);
Robin James Green, Duvall, WA (US);
Isaac Serrano Guasch, Barcelona, ES;
Stephen John Hart, San Juan Capistrano, CA (US);
Robert Alan Hess, Mesa, AZ (US);
Margaret H. Hsu, Pasadena, CA (US);
Christoph Von Jutrzenka, Santa Barbara, CA (US);
DeaGyu Kim, Pasadena, CA (US);
Mark Anthony Loya, Temple City, CA (US);
Kelly Swan MacNeill, Seattle, WA (US);
Benjamin Francis Neil, South Pasadena, CA (US);
Kamran Qaderi, San Gabriel, CA (US);
Tina Qin, Rosemead, CA (US);
Jesus Manuel Caridad Ramirez, Altadena, CA (US);
Jayakrishna Sashidharan, San Gabriel, CA (US);
Asher Zelig Sefami, Altadena, CA (US);
Jeff Smith, Las Vegas, NV (US);
Robert David Srinivasiah, Mountain View, CA (US);
Sameer Sudhir Walavalkar, Glendale, CA (US);
Joshua D. Wiensch, Altadena, CA (US);
Daniel Dereck Williamson, Brighton, GB;
Pacific Light & Hologram, Inc., San Gabriel, CA (US);
Abstract
Methods, apparatus, devices, subsystems, and systems related to irregular devices and methods for designing and fabricating the irregular devices are provided. In one aspect, a device includes: a backplane comprising a plurality of circuits and a plurality of elements arranged on the backplane. Each of the plurality of elements includes a metallic electrode. Each of the metallic electrodes is coupled to a respective circuit of the plurality of circuits in the backplane through a corresponding via of a plurality of vias, and a position relationship between the metallic electrode and the corresponding via satisfies one or more criteria.