The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Nov. 27, 2020
Applicant:

Nextchip Co., Ltd., Seongnam-si, KR;

Inventors:

Young Seok Oh, Seoul, KR;

Hye Seong Jo, Seongnam-si, KR;

Kyoung Tae Kim, Seongnam-si, KR;

Assignee:

Nextchip Co., Ltd., Seongnam-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 20/56 (2022.01); B60W 40/06 (2012.01); B60W 50/14 (2020.01); B60W 60/00 (2020.01); G06T 7/64 (2017.01);
U.S. Cl.
CPC ...
G06V 20/588 (2022.01); B60W 40/06 (2013.01); B60W 50/14 (2013.01); B60W 60/001 (2020.02); G06T 7/64 (2017.01); B60W 2420/403 (2013.01); B60W 2552/20 (2020.02); G06T 2207/30252 (2013.01);
Abstract

In order to determine whether bumps and depressions are present on the ground in a target image, the present invention: acquires a V-disparity map on the basis of a target image acquired by means of an image sensor; detects, in the V-disparity map, at least one component indicating information about the ground in the target image; determines a polynomial in a coordinate system in the V-disparity map for the component; determines a straight line passing through two different inflection points on a curve, which corresponds to the polynomial, in the coordinate system in the V-disparity map; determines a target point on the curve, the target point having a tangential slope identical to the slope of the straight line; calculates the distance between the straight line and the target point; and determines, on the basis of the distance, whether the ground includes bumps and depressions.


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