The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Mar. 11, 2024
Applicants:

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xue Zhao, Beijing, CN;

Xiaodong Xie, Beijing, CN;

Min He, Beijing, CN;

Tengfei Zhong, Beijing, CN;

Xinxiu Zhang, Beijing, CN;

Tianyu Zhang, Beijing, CN;

Huayu Sang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G03D 15/04 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0446 (2019.05); G03D 15/04 (2013.01); G06F 3/0445 (2019.05); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01);
Abstract

The present disclosure relates to a method for fabricating a touch substrate, a touch substrate and a touch device. The method includes: forming, through a splicing exposure process, a first electrode layer including a metal strip in an edge region thereof and a first metal mesh pattern connected with the metal strip; forming, on one side of the first electrode layer and through a splicing exposure process, a second electrode layer including a metal strip in an edge region thereof and a second metal mesh pattern connected with the metal strip and insulated from the first metal mesh pattern, the metal strip of the first electrode layer directly contacting the metal strip of the second electrode layer to form a metal stack; and forming a wire electrically connected with one of the first and metal mesh patterns of the first and second electrode layers by using the metal stack.


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