The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Mar. 11, 2024
Applicants:

Boe Mled Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Pei Li, Beijing, CN;

Haiwei Sun, Beijing, CN;

Ming Zhai, Beijing, CN;

Lu Yu, Beijing, CN;

Kangle Chang, Beijing, CN;

Jinpeng Li, Beijing, CN;

Pengjun Cao, Beijing, CN;

Yutao Hao, Beijing, CN;

Shubai Zhang, Beijing, CN;

Shuo Wang, Beijing, CN;

Pei Qin, Beijing, CN;

Zewen Gao, Beijing, CN;

Yali Zhang, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); H01L 25/16 (2023.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/854 (2025.01); H10H 20/856 (2025.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); H01L 25/167 (2013.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01); H01L 2224/13139 (2013.01); H10H 20/0361 (2025.01); H10H 20/8514 (2025.01); H10H 20/854 (2025.01);
Abstract

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.


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