The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Jun. 26, 2023
Silicon Laboratories Inc., Austin, TX (US);
Silicon Laboratories Inc., Austin, TX (US);
Abstract
A device enclosure for a wafer level chip scale package (WLCSP) device that is particularly useful for package qualification testing includes a base for receiving the WLCSP device and a removable cover. The device enclosure allows testing to occur without handling of the device. The base has through holes in a center portion of a bottom of the base to allow electrical contacts of the WLCSP device to be exposed when the WLCSP device is mounted in the device enclosure. The cover attaches to the base with screws and has a plurality of openings to provide ingress of air into the device enclosure. A peripheral of the bottom of the cover is recessed from a center portion of the bottom of the cover and the center portion engages the WLCSP device to secure the WLCSP device in the device enclosure when the base and cover are secured together.