The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jul. 08, 2024
Applicant:

Universal Display Corporation, Ewing, NJ (US);

Inventors:

Matthew King, Moorestown, NJ (US);

Gregg Kottas, Ewing, NJ (US);

Gregory McGraw, Yardley, PA (US);

William E. Quinn, Whitehouse Station, NJ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B05B 1/00 (2006.01); B05B 1/24 (2006.01); B05B 1/28 (2006.01); B41J 2/005 (2006.01); C23C 14/12 (2006.01); C23C 14/24 (2006.01); H10K 50/11 (2023.01); H10K 71/00 (2023.01); H10K 71/13 (2023.01); H10K 71/18 (2023.01); H10K 101/10 (2023.01);
U.S. Cl.
CPC ...
C23C 14/24 (2013.01); B05B 1/005 (2013.01); B05B 1/24 (2013.01); B05B 1/28 (2013.01); B41J 2/005 (2013.01); B41J 2/14 (2013.01); B41J 2/14145 (2013.01); C23C 14/12 (2013.01); H10K 50/11 (2023.02); H10K 71/00 (2023.02); H10K 71/13 (2023.02); H10K 71/18 (2023.02); H10K 2101/10 (2023.02);
Abstract

Embodiments of the disclosed subject matter provide an apparatus having a device with a micronozzle array disposed on a micro-fabricated fluidic die. The device may include a first gas distribution plate and a second opposing plate, where the micro-fabricated fluidic die is disposed between the first gas distribution plate and the second opposing plate, wherein the first gas distribution plate is irreversibly joined to the micronozzle array with a seal that is gas-tight, and where the first gas distribution plate includes a plurality of sealed flow paths. A manifold may be reversibly joined to the first gas distribution plate, where the micro-fabricated fluidic die and the first gas distribution plate and the second opposing plate are disposed between the manifold. A thermally conductive plate may have at least one window that provides a clearance fit for the device across a range of motion relative to the thermally conductive plate.


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