The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Dec. 02, 2020
Applicant:
Mektec Corporation, Tokyo, JP;
Inventors:
Assignee:
MEKTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/25 (2018.01); C08G 73/10 (2006.01); C09J 127/16 (2006.01); C09J 127/20 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C09J 7/25 (2018.01); C08G 73/1007 (2013.01); C08G 73/1067 (2013.01); C09J 127/16 (2013.01); C09J 127/20 (2013.01); H05K 1/0393 (2013.01); H05K 3/4688 (2013.01); C09J 2479/08 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/015 (2013.01); H05K 2201/05 (2013.01);
Abstract
An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10cc·cm/cm·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.